Descripción
- IR6500 Rework station for laptop motherboards, desktop computer motherboards,server boards, industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD TVs and other large circuit board BGA rework.
- IR6500 innovative designs an effective solution to general of infrared rework station vulnerable to the impact of air flow. will lead an inaccurate of temperature control can easily deal with lead-free soldering rework. It can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at one time.
- IR6500 Rework station can be connected to a computer to be controlled more conveniently with a built-in USB connector and proprietary Software attached to it. It can easily rework the variety of CPU's seat, all kinds of shielding enclosures, replacement of various components slot can easily deal with lead-free soldering rework.
- It sensitive temperature measurement sensor to obtain an accurate and instantaneous temperature reading and monitoring. The BGA rework station the technology of closed-loop temperature control ensures accurate temperature process and even heat distribution.
- Machine overall system integration Design, Rework station more integrated workbench area occupied by smaller, Didn't mixed and disorderly of cables. Linear guide type Bracket with abnormity pole can be locking, adjusted by rotating the handle, can be very easily fixed PCB board, effectively prevent the deformation of PCB board.
Basic Parameters: Heating: IR Dimension: L475mmx W480mmx H420mm Weight: 15kg Total weight: About 17 kg, vary with the differen need of the users Electrical Parameters: Power: 110V Upper Heating: IR Size of Upper heating: 80mm x 80mm onsumption of upper heating: 400W Bottom Heating: IR Size of Bottom heating: 170mm x170mm Consumption of Bottom heating: 800W General power: 1250W Temperature Control: Control mode of Upper: Independent temperature control, high-precision closed-loop control, precision ± 0.5% Control mode of Bottom: Independent temperature control, high-precision closed-loop control, precision ± 0.5% Rework Function: SMD---Suit for welding, remove or repair packaged devices such as BGA,PBGA,CSP,multi-layer substrates, EMI metallic shield product and solder/lead free Reworkwelding Size of applicable chips: ≤70mm x70 mm Size of applicable PCB: ≤400mm x305mm
