Adjustable BGA Reballing Station Kit HT-90 Aluminum Alloy Stencil Holder for Laptop CPU Phone Repair Diagonal Solder Ball Jig with Drainage Channel 9-43mm

Name: Adjustable BGA Reballing Station Kit HT-90 Aluminum Alloy Stencil Holder for Laptop CPU Phone Repair Diagonal Solder Ball Jig with Drainage Channel
Brand: Walfront
Price: 849.56 BOB
Availability: InStock

ID del producto: 239438865

Transacción segura

💧Innovative drainage channel for excess solder

🔩Durable aluminum alloy frame

⚙️Precision fit for 9-43mm BGA chips

Descripción

⚙️ Elevate your soldering game with precision and style!

SMART DRAINAGE GROOVE - Effortlessly channels out excess solder balls, keeping your workspace clean and efficient.
ESSENTIAL FOR TECH PROS - Ideal for laptop CPU and mobile phone BGA reballing, empowering your repair workflow.
UNIVERSAL COMPATIBILITY - Fits a wide range of BGA chips from 9mm to 43mm, ensuring versatile repair options.
ERGONOMIC ADJUSTABLE KNOB - Easily customize chip size settings for precise solder ball placement every time.
PREMIUM ALUMINUM ALLOY BUILD - Lightweight yet robust structure resists oxidation and wear for long-lasting performance.

The Adjustable BGA Reballing Station Kit HT-90 features a high-quality aluminum alloy frame designed for durability and lightweight handling. It supports BGA chip sizes from 9mm to 43mm with an adjustable knob and includes a smart drainage channel to remove excess solder balls, making it an essential tool for professional laptop CPU and mobile phone repairs.

Presupuesto

Manufacturer	Walfront
Part Number	Walfronthfrbemdv2w
Item Weight	1.76 ounces
Finish	Finish
Material	Aluminum alloy
Power Source	PowerSource
Installation Method	InstallationMethod
Item Package Quantity	1
Spout Height	1 Centimeters
Included Components	inc
Batteries Included?	No
Batteries Required?	No