🔧 Elevate Your Electronics Game!
The MAX MCR Electronic Grade Potting Compound is a high-performance encapsulating solution designed for printed circuit boards. This opaque black epoxy resin offers excellent insulation for both AC and DC applications, bonds effectively to various substrates, and cures at room temperature. With a low exotherm and a maximum operating temperature of 190°F (90°C), it ensures durability and reliability in demanding environments.
S**Y
Good viscosity
I like this over the previous stuff was using because this is a thinner viscosity...pours easier and quicker. Get more done in less time since not waiting for the pour. Overall seems to work well for electronic encapsulation.
C**S
product review
Bought two sets of this kit. First set was poured and had to leave it over night. Product was mixed continuously for 10 minutes. after leaving it overnight the product hardened but did not completely cure overnight. some areas are still tacky and leave residue if touched. Second kit was also mixed continuously for 10 minutes. After 52 minutes mix started to heat up and within seconds it was steaming vigorously. By the time I attempted to pour (literally 53 minutes of mixing) it hardened mid pour instantly. Seams like the second batch is working properly but after the 30 working time the material will flash and harden instantly.
R**S
Five Stars
Excellent
R**U
Just what I needed!
This product was used to seal electrical wires on a submersible motor. It cured quickly and overnight it hardened to a glass like finish. Works great!
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