Advances in Embedded and Fan-Out Wafer Level Packaging Technologies (IEEE Press)

A well-researched summary of today’s developments in two of the most important packaging technologies driving product miniaturization and increased feature complexity. Included are developments from many of the leading companies developing these technologies. For anyone trying to understand how these technologies perform or are constructed, this book contains excellent relevant photos and cross-sections of images explaining the various application approaches.Given that Moore’s law of traditional transistor scaling has slowed down, these examples of interconnect and signal path reduction are very relevant for any Semiconductor practitioner or electronic system designer. The rapid increase in AI functionality in many handheld and automotive vehicles means that these technologies may be adopted in new products. All people involved in electronic systems design will benefit from the knowledge provided in this book by the leading experts from many of the key worldwide companies and institutes.The editors have compiled a complete understanding of these critical new interconnect technologies starting with design considerations, to manufacturing options, new materials, reliability implications, and the latest Heterogeneous (multi-die) technologies now in development.