Thermal And Structural Electronic Packaging Analysis For Space And Extreme | Desertcart Bolivia
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)
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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)
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The product exactly matches the description. Very satisfied with my purchase.
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